Cypress Enables Dynamic 3D Graphics in Hybrid Instrument Clusters and Head-Up Displays With New Automotive MCU Solution
Newest Member of Traveo™ Microcontroller Family Integrates More Onboard Memory with a 3D and 2.5D Graphic Engine in a Single-chip, Scalable Solution
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Pictured is Cypress' Traveo automotive MCU for instrument cluster applications. (Photo: Business Wire)
"Our automotive customers are looking to integrate increasingly more
dynamic 3D graphics in their hybrid instrument cluster and head-up
displays to appeal to consumers," said
The Traveo S6J32xEK series integrates up to 4MB of high-density embedded flash, 512 KB RAM and 2MB of Video RAM, an Arm® Cortex®-R5 core at 240-MHz performance, a Low-Voltage Differential Signaling (LVDS) video output, a Low-Voltage Transistor-Transistor Logic (LVTTL) video output and a 6x stepper motor control. This combination enables the devices to serve as single-chip solutions to drive two displays. The devices have up to two 12-pin HyperBus memory interfaces that dramatically improve read and write performance of graphical data and other data or code. A single HyperBus interface can be used to connect to two memories for Firmware Over-The-Air (FOTA) updates, which enable end-users to get software fixes and new features and applications for their vehicles on-the-go. The devices support all in-vehicle networking standards required for instrument clusters, including Controller Area Network-Flexible Data (CAN-FD) and Ethernet AVB. Additionally, the series provides robust security with integrated enhanced secure hardware extension (eSHE) support.
The Traveo S6J32xEK series include 50 channels of 12-bit Analog to Digital Converters (ADC), 12 channels of multi-function serial interfaces and I2S interfaces with an AUDIO DAC to output the complex, high-quality sounds required in today's instrument clusters. The devices' support for Ethernet AVB delivers increased bandwidth in multimedia applications and reduced programming time. The S6J32xEK series offers functional safety features to support Automotive Safety Integrity Level (ASIL) B, and the devices feature a wide ambient temperature range of -40˚C to +105˚C. The Traveo family is backed by a comprehensive tools and software ecosystem that simplifies system integration, including AUTOSAR MCAL 4.0.3 support.
The Traveo S6J32xEK series is sampling now and will be in production in the first quarter of 2018. The MCUs are available in a 208-pin and 216-pin thermally enhanced quad flat package (TEQFP).
Cypress Enables Leading-Edge Automotive Systems
Cypress works with the world's top automotive companies to bring
leading-edge automotive systems typical of luxury models to mainstream
vehicles, including Advanced Driver Assistance Systems (ADAS), 3-D
graphics displays, wireless connectivity, full-featured touchscreens and
superior body electronics. Cypress' automotive portfolio includes the
Traveo MCU family, power-management ICs (PMICs), PSoC® programmable
system-on-chip solutions, CapSense® capacitive-sensing
solutions, TrueTouch® touchscreens, NOR flash, F-RAM™ and
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Cypress is the leader in advanced embedded system solutions for the world's most innovative automotive, industrial, home automation and appliances, consumer electronics and medical products. Cypress' programmable systems-on-chip, general-purpose microcontrollers, analog ICs, wireless and USB-based connectivity solutions and reliable, high-performance memories help engineers design differentiated products and get them to market first. Cypress is committed to providing customers with the best support and engineering resources on the planet enabling innovators and out-of-the-box thinkers to disrupt markets and create new product categories in record time. To learn more, go to www.cypress.com.
Cypress, the Cypress logo, PSoC and CapSense are registered trademarks
and Traveo, HyperBus and F-RAM are trademarks of
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